Model Number X2 550 BE
Processor Frequency 3.1GHz
L3 Cache Size 6MB L3
Nominal Voltage 0.850-1.425V
L1 Cache Sizes: 64K of L1 instruction and 64K of L1 data cache per core
L2 Cache Sizes: 512KB of L2 data cache per core
L3 Cache Size: 6MB (shared)
Memory Controller Type: Integrated 128-bit wide memory controller
Memory Controller Speed: Up to 2.0GHz with Dual Dynamic Power Management (all current AM3 processors)
Types of Memory Supported: Support for unregistered DIMMs up to PC2 8500 (DDR2-1066MHz) -AND- PC3 (DDR3-1333MHz)
HyperTransport 3.0 Link: One 16-bit/16-bit link @ up to 4.0GHz full duplex (2.0GHz x2)
Total Processor Bandwidth: Up to 37.3 GB/s total bandwidth
Packaging: Socket AM3 938-pin organic micro pin grid array (micro-PGA)
Fab location: Global Foundaries Fab 1 Module 1
Process Technology: 45-nanometer DSL SOI (silicon-on-insulator) technology
Approximate Transistor count: ~ 758 million (45nm)
Approximate Die Size: 258 mm2 (45nm)
Max Ambient Case Temp / X4 CPUs: 70o Celsius
Nominal Voltage: 0.850-1.425V
Max TDP: 80 Watts
